I'm working on an I/O PCB (ExpressPCB) for my Dynaco PAS to replace the original jacks. At the moment, my "design" utilizes a ground plane foil on the inside. I am wondering if there might be a good reason not to use a ground plane here and if just daisy-chaining a wire through all the ground lugs might be better (though the ground plane foil is much more convenient and does not add to the cost).
There are other replacement I/O PCBs available for the PAS that also use a ground plane foil to some extent. But, my ground plane has much more area than some of the others. Does this matter?
This is actually my second rebuild of this PAS. I had a problem of hum increasing with the volume control in the first rebuild. For the first rebuild, the I/O PCB ground plane was in direct contact with the back panel. For this second rebuild, I was going to try it with the new I/O PCB ground plane not contacting the back panel and with a wire running from the ground plane foil to a star ground elsewhere (closest thing I can get to a star ground, anyway).
Thoughts?
Thanks.
Peter